Description
Product Name: Hexafluoro-1,3-butadiene C4F6 Gas Perfluorobutadiene Halocarbon 2316
CAS: 685-63-2
Purity: 99.99% ~ 99.999%
Product specifications: 4L/8L/10L/40L/47L/50L
Product form: Hexafluoro-1,3-butadiene C4F6 Gas Perfluorobutadiene Halocarbon 2316
Main use: Hexafluoro-1,3-butadiene C4F6 Gas Perfluorobutadiene Halocarbon 2316 is used as an intermediate in the production of certain fluoropolymers.
Availability : In Stock
What is Hexafluoro-1,3-butadiene C4F6 Gas?
Hexafluoro-1,3-butadiene (C4F6) is used as an environmentally friendly etching gas with a low greenhouse effect. It is a relatively new etch gas for the manufacturing of semiconductor devices, especially in critical etch processes that need high aspect ratios and selectivity, mainly in dry etching processes for semiconductors.
Certificate of Analysis
Component | Unit | Specification | |
C4F6 | % | ≥99.99 | |
N2 | ppm | ≤40 | |
O2+Ar | ppm | ≤10 | |
CO2 | ppm | ≤20 | |
Other Fluorocarbon | ppm | ≤200 | |
H2O | ppm | ≤5 | |
Acidity as HF | ppm | ≤5 | |
IPA | ppm | ≤5 |
NOTE : For other grade 99.999% , don’t hesitate to call or contact tao.hu@asiaisotope.com for more technical details.
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What are applications of Hexafluoro-1,3-butadiene C4F6 Gas ?
Hexafluoro-1,3-butadiene C4F6 Gas is a relatively new etch gas for the manufacturing of semiconductor devices, especially in critical etch processes that need high aspect ratios and selectivity, mainly in dry etching processes for semiconductors.
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Used as a dry etching gas in silicon-based integrated circuits
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Many application advantages in plasma, ion beam or sputter dry etching in semiconductor devices manufacturing.
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High aspect ratio etching
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