Description
Product Name: Hexafluoroethane C2F6 Gas
CAS: 76-16-4
Purity: 99.999%
Product specifications: 4L/8L/10L/40L/47L/50L
Product form: Hexafluoroethane C2F6 Gas
Main use: Hexafluoroethane C2F6 is used as a refrigerant and in fire suppression systems.
Availability : In Stock
Certificate of Analysis
Component | Unit | Specification | |
C2F6 | % | ≥99.999 | |
H2 | ppm | ≤0.50 | |
O2+Ar | ppm | ≤1.00 | |
N2 | ppm | ≤4.00 | |
CO | ppm | ≤0.50 | |
CO2 | ppm | ≤0.50 | |
THC as CH4 | ppm | ≤0.50 | |
CF4 | ppm | ≤1.00 | |
Other haloalkan | ppm | ≤1.00 | |
H2O | ppm | ≤1.00 | |
Acidity as HF | ppm | ≤0.10 | |
Total Impurity Content | ppm | <10.00 |
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Applications and Industries
Hexafluoroethane (C2F6) is a versatile compound primarily used as a plasma etchant in semiconductor manufacturing, a component in some refrigerants, and a fire extinguishing agent. It also finds applications in dielectric fluids, as a propellant, and in retinal surgery.
- Hexafluoroethane is a key component in reactive ion etching, a process used to selectively remove materials from silicon wafers.
- It’s used to etch silicon dioxide over silicon and to etch metal silicides and oxides.
- Its high fluorine-to-carbon ratio and ability to generate reactive trifluoromethyl radicals make it a useful etchant.
- Hexafluoroethane is used in some refrigerant mixtures, often combined with trifluoromethane.
- It’s a component in refrigerants R508A and R508B.
- Due to its non-toxic and non-flammable properties, hexafluoroethane can be used as a fire extinguishing agent.
- Dielectric fluid: It can be used as a dielectric fluid in various applications.
- Propellant: It can act as a propellant in aerosols.
- Retinal surgery: Hexafluoroethane can be used as a tamponade to aid in retinal reattachment.
- Plasma chamber cleaning: It can be used to clean plasma chambers in semiconductor manufacturing.
- Expansion agent: It can be used as an expansion agent for polyolefins and polyurethanes.
- Inert medium: It can provide an inert environment in certain applications.
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